Provider profile

Microdul AG

Short description

Microdul AG - Your trusted partner for advanced microelectronics. We master the processes at all implementation stages — from development and engineering through production and test of custom applications. We strive to delight and inspire our customers.

Posts (2)

Offers, Brands, Standards

  • P Sensors
  • P Electronics and sensors
  • P Optoelectronics
  • P Further electronics and sensors
  • S Prototyping
  • S Contract manufacturing
  • S Clean room production
  • S Microscopic material analysis
  • S Quality assurance
  • S Technology development
  • S Research and development
  • S Consulting
  • S Consulting, engineering, data generation
  • S Entire systems
  • S Circuits
  • S Embedded systems
  • S Electronic systems
  • S Contract manufacturing electronics
  • S Part testing
  • S Assembly
  • S ISO 9001:2015
  • S EKAS 6508
  • S ISO 13485:2016

About us

Microdul possesses a broad and pro-found know-how in the multi-faceted world of micro-electronics. In our business areas of semiconductors, modules and thick-film, we convert this know-how into fascinating products and services. Certifications in ISO 9001 and ISO 13485 are witnesses to our process excellence — as well as the numerous, successful customer audits. Whether you need a standard pro-duct or an individual solution — with Microdul as your partner, you will successfully cope with any hurdle.

Microdul masters the following process technologies and more:

-Miniaturisation of electronics

-Substrate Design

-Die and Wire Bonding (Al, Au), 15-350 um Wire Diameter

-Chip on Chip (COC), Chip on Ceramic, Chip on Board (COB), Chip on Flex (COB), Package on Package (POP)

-Globtop coating

-Flip chip assembly 150um pitch

-SMD mounting, 01005 Packages (0.2 x 0.4mm)

-Stud Bumping (Au) on Die and Wafer.

-Assembly on different substrates; flex rigid, thick film, thin film, Ceramic packages, direct copper bonding DCB

-Solder Ball Attach (BGA)

-Vacuum soldering (for power applications, CPV)

-Hand soldering

-Adhesive joining

-Heat sealing

-Laser trimming (active/passive)      

-Module potting

-100% Functional testing

-Failure analysis (X-Ray, X Section

-ISO 9001, ISO 13485 (quality management system for medical modules)

-ASIC Design (Low-Power, mixed Signal Arrays)

-Wafer Service, Microdul multiprojekt-wafer (MPW)

 

 

General information

Company size
51-100

Founded
1991

Headquarters
Zürich, Schweiz
8045 Zürich

Direct Contacts

 Adrian Stalder

Adrian Stalder

Salesengineer Module/ThickFilm

Get in touch
cpt
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